1. TRAI and C-DoT Sign MoU to Establish Mechanism of Technical and Institutional Cooperation in Telecommunications
On 25th July 2023, the Telecom Administrative Power of India (TRAI) and the Middle forImprovement of Telematics (C-Spot) marked an update of figuring
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1. CDAC and Arm Collaborates to Expand Semiconductor Support Under the DLI
The Middle for Improvement of Cutting Edge Figuring (CDAC) has teamed up with Joined together Realm (UK) based semiconductor IP (Protected innovation) organization Arm through the "Arm Adaptable Access
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